Brief: Discover the 1060 Aluminum Alloy Foil (0.05mm/1200mm), designed for chip heat dissipation in electronic packaging. With high thermal conductivity (230 W/m*K), ultra-thin design, and corrosion resistance, it's perfect for smartphones, servers, and automotive electronics. Ideal for modern, eco-friendly thermal management solutions.
Related Product Features:
High thermal conductivity (230 W/m*K) ensures efficient heat dissipation for high-performance chips.
Ultra-thin 0.05mm thickness fits compact electronic designs like smartphones and wearables.